3-D electronic interconnect packaging

IEEE Aerospace Applications Conference Proceedings

Volumn 1, Issue , 1996, Pages 363-373

  Sienski, Ken ^a   Eden, Richard ^a   Schaefer, Dean ^a  

^a RAYTHEON COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BANDWIDTH; COOLING; ELECTRIC WIRING; HEAT CONDUCTION; INTEGRATED CIRCUITS; MULTICHIP MODULES; SUBSTRATES; SYNTHETIC DIAMONDS; TECHNOLOGY; THERMAL CONDUCTIVITY; THREE DIMENSIONAL;

CHARACTERIZATION CUBE; GLOBAL COMMUNICATION BANDWIDTH; INTERCONNECT LENGTH; THREE DIMENSIONAL INTERCONNECT;

ELECTRONICS PACKAGING;

EID: 0029755623     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)