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Journal of Materials Science

Volumn 46, Issue 8, 2011, Pages 2654-2661

Interfacial reactions between eutectic Sn-Pb solder and Co substrate

(2) Wang, Chao Hong a Kuo, Chun Yi a

a NATIONAL CHUNG CHENG UNIVERSITY (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CO-SUBSTRATE; DIFFUSION CONSTANT; GROWTH BEHAVIOR; INTERFACIAL REACTIONS; LAYER GROWTH; LAYER THICKNESS; REACTION CONSTANT; REACTION TIME; RICH PHASE; SNPB SOLDER;

ACTIVATION ENERGY; BEHAVIORAL RESEARCH; LEAD; REACTION KINETICS;

TIN;

EID: 79751535472 PISSN: 00222461 EISSN: 15734803 Source Type: Journal
DOI: 10.1007/s10853-010-5121-0 Document Type: Article

Times cited : (28)

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