Prognostics of thermal fatigue failure of solder joints in avionic equipment

IEEE Aerospace and Electronic Systems Magazine

Volumn 27, Issue 4, 2012, Pages 16-24

  Johansson, Jonas ^a,b   Leisner, Peter ^b  

^a SAAB AB   (Sweden)

^b JÖNKÖPING UNIVERSITY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

FATIGUE CALCULATIONS; LEVEL OF DETAIL; PRACTICAL METHOD; REMAINING USEFUL LIVES; SAFETY-CRITICAL; SOLDER JOINTS; TEMPERATURE DATA; THERMAL FATIGUE FAILURES;

THERMAL FATIGUE;

SYSTEMS ENGINEERING;

EID: 84861747658     PISSN: 08858985     EISSN: None     Source Type: Journal    
DOI: 10.1109/MAES.2012.6203714     Document Type: Article

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