Prognostics Health Monitoring (PHM) for prior-damage assessment in electronics equipment under thermo-mechanical loads

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 1097-1111

  Lall, Pradeep ^a   Hande, Madhura ^a   Bhat, Chandan ^a   Suhling, Jeff ^a   Lee, Jay ^b  

^a AUBURN UNIVERSITY   (United States)

^b UNIVERSITY OF CINCINNATI   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATION ALGORITHMS; RESIDUAL LIFE; TEMPERATURE VARIATIONS; THERMOMECHANICAL LOADS;

ALGORITHMS; BUILT-IN SELF TEST; CONDITION MONITORING; RELIABILITY ANALYSIS; THERMAL CYCLING;

ELECTRONICS ENGINEERING;

EID: 35348922235     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373934     Document Type: Conference Paper

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