Model for BGA and CSP reliability in automotive underhood applications

IEEE Transactions on Components and Packaging Technologies

Volumn 27, Issue 3, 2004, Pages 585-593

  Lall, Pradeep ^a   Islam, Mohd Nokibul ^a   Singh, Naveen ^a   Suhling, Jeffrey C ^a   Darveaux, Robert ^b  

^a AUBURN UNIVERSITY   (United States)

^b AMKOR TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

APPLICATION SPECIFIC INTEGRATED CIRCUITS; AUTOMOBILE ELECTRONIC EQUIPMENT; CRACK PROPAGATION; DIFFERENTIAL SCANNING CALORIMETRY; FINITE ELEMENT METHOD; GLASS TRANSITION; MATHEMATICAL MODELS; PRINTED CIRCUIT BOARDS; RELIABILITY; SOLDERED JOINTS; TEMPERATURE; THERMAL EXPANSION;

BALL GRID ARRAY; BISMALEIMIDE TRIAZINE; CERAMIC BALL GRID ARRAY; NON SOLDER MASK DEFINED; PLASTIC BALL GRID ARRAY PACKAGES; THERMOMECHANICAL ANALYZER;

ELECTRONICS PACKAGING;

EID: 4444235973     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2004.831824     Document Type: Article

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