Leading indicators of failure for prognostication of leaded and lead-free electronics in harsh environments

IEEE Transactions on Components and Packaging Technologies

Volumn 32, Issue 1, 2009, Pages 135-144

  Lall, Pradeep ^a   Islam, Nokibul ^a,b   Choudhary, Prakriti ^a,c   Suhling, Jeffrey C ^a  

^a AUBURN UNIVERSITY   (United States)

^b AMKOR TECHNOLOGY   (United States)

^c INTEL CORPORATION   (United States)

Author keywords

Damage precursors; Lead free solders; Reliability

Indexed keywords

AGING OF MATERIALS; BRAZING; ELECTRONICS PACKAGING; INDICATORS (INSTRUMENTS); LEAD; PLASTIC LAMINATES; SOLDERING ALLOYS; WELDING;

63SN-37PB; DAMAGE PRECURSORS; DAMAGE PROGRESSIONS; DAMAGE STATE; DESIGN MARGINS; DISCRETE DEVICES; ELECTRONIC ASSEMBLIES; ELECTRONIC COMPONENTS; HARSH ENVIRONMENTS; HEALTH-MONITORING; INTERMETALLIC GROWTHS; LEAD-FREE ELECTRONICS; LEAD-FREE SOLDERS; LEADING INDICATORS; LIFE PREDICTIONS; MEMS PACKAGES; MICRO-STRUCTURAL EVOLUTIONS; NEW COMPONENTS; PHASE SIZES; PLASTIC BALL GRID ARRAYS; PROGNOSTIC INDICATORS; RESIDUAL LIVES; SOLDER INTERCONNECTS; THERMO-MECHANICAL LOADS;

DAMAGE DETECTION;

EID: 63049105034     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2008.2012129     Document Type: Article

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