Multi-domain analysis of PBGA solder joints for structural design optimization

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 1332-1338

  Rassaian, M ^a   Chang, W ^a   Lee, Jung Chan ^a  

^a BOEING COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; BALL GRID ARRAYS; ELECTRONICS PACKAGING; LIFE CYCLE; NETWORK COMPONENTS; SOLDERED JOINTS; SOLDERING; STRESS ANALYSIS; STRUCTURAL DESIGN; STRUCTURAL OPTIMIZATION; THERMAL FATIGUE; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; PLASTICS APPLICATIONS; STRAIN; THERMAL CYCLING;

ANALYTICAL PREDICTIONS; CYCLIC THERMAL LOADING; EXPERIMENTAL ASSESSMENT; PLASTIC BALL GRID ARRAYS; SOLDER JOINT FATIGUE; STRESS AND STRAIN ANALYSIS; STRUCTURAL DESIGN OPTIMIZATION; THERMO-MECHANICAL LOADING;

FINITE ELEMENT METHOD; ELECTRONICS PACKAGING;

PLASTIC BALL GRID ARRAYS (PBGA);

EID: 0031625738     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678917     Document Type: Conference Paper

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