-
1
-
-
0003418226
-
-
CRC Press, New York
-
P. Lall, M. Pecht, E. Hakim, Influence of Temperature on Microelectronics and System Reliability, CRC Press, New York, 1997
-
(1997)
Influence of Temperature on Microelectronics and System Reliability
-
-
Lall, P.1
Pecht, M.2
Hakim, E.3
-
2
-
-
84928644833
-
-
MIL-Handbook 217F
-
MIL-Handbook 217F, Notice 2, 1995
-
(1995)
Notice 2
-
-
-
4
-
-
11244341227
-
Life consumption monitoring for electronics prognostics
-
6-13 March
-
S. Mishra, S. Ganesan, M. Pecht, J. Xie,"Life consumption monitoring for electronics prognostics,"Proceedings of the 2004 IEEE Aerospace Conference, Volume 5, 6-13 March 2004
-
(2004)
Proceedings of the 2004 IEEE Aerospace Conference
, vol.5
-
-
Mishra, S.1
Ganesan, S.2
Pecht, M.3
Xie, J.4
-
5
-
-
27744474634
-
IMA aircraft improvements
-
September
-
C. Wilkinson,"IMA aircraft improvements,"IEEE Aerospace and Electronic Systems Magazine, v 20, n 9, September 2005, pp. 11-17
-
(2005)
IEEE Aerospace and Electronic Systems Magazine
, vol.20
, Issue.9
, pp. 11-17
-
-
Wilkinson, C.1
-
6
-
-
0029368858
-
Physics-of-failure: An approach to reliable product development
-
Sept.-Oct.
-
M. Pecht, A. Dasgupta,"Physics-of-failure: an approach to reliable product development,"Journal of the Institute of Environmental Sciences, v 38, n 5, Sept.-Oct. 1995, p 30-4
-
(1995)
Journal of the Institute of Environmental Sciences
, vol.38
, Issue.5
, pp. 30-34
-
-
Pecht, M.1
Dasgupta, A.2
-
7
-
-
33847121320
-
Lifetime prediction of SnPb and SnAgCu solder joints of chips on copper substrate based on crack propagation FE-Analysis
-
EuroSime 2006, Como, Italy, April 24-26
-
S. Deplanque, W. Nuchter, B. Wunderle, R. Schacht, B. Michel,"Lifetime Prediction of SnPb and SnAgCu Solder Joints of Chips on Copper Substrate Based on Crack Propagation FE-Analysis,"7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSime 2006, Como, Italy, April 24-26, 2006
-
(2006)
7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems
-
-
Deplanque, S.1
Nuchter, W.2
Wunderle, B.3
Schacht, R.4
Michel, B.5
-
8
-
-
36349002345
-
Thermo-mechanical investigations on the effects of the solder meniscus design in solder joint lifetime for power electronic devices
-
EuroSime 2007, London, April
-
M. Bouarroudj; Z. Khatir; S. Lefebvre; L. Dupont,"Thermo-mechanical investigations on the effects of the solder meniscus design in solder joint lifetime for power electronic devices,", 8th International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, EuroSime 2007, London, April 2007
-
(2007)
8th International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems
-
-
Bouarroudj, M.1
Khatir, Z.2
Lefebvre, S.3
Dupont, L.4
-
9
-
-
33645162512
-
Life margin assessment with Physics of Failure Tools application to BGA packages
-
Elsevier
-
B. Foucher, J. Thomas, F. Mounsi, M. Jeremias,"Life margin assessment with Physics of Failure Tools application to BGA packages,"Microelectronics Reliability 46 (2006), Elsevier, pp 1013-1018
-
(2006)
Microelectronics Reliability
, vol.46
, pp. 1013-1018
-
-
Foucher, B.1
Thomas, J.2
Mounsi, F.3
Jeremias, M.4
-
10
-
-
0036923936
-
Virtual life assessment of electronic hardware used in the Advanced Amphibious Assault Vehicle (AAAV)
-
R. Valentin, J. Cunningham, M. Osterman, A. Dasgupta, M. G. Pecht, D. Tsagos,"Virtual life assessment of electronic hardware used in the Advanced Amphibious Assault Vehicle (AAAV),"Proceedings of the 2002 Winter Simulation Conference, pt. 1, pp 948-53 vol.1, 2002
-
(2002)
Proceedings of the 2002 Winter Simulation Conference
, vol.1
, pp. 948-953
-
-
Valentin, R.1
Cunningham, J.2
Osterman, M.3
Dasgupta, A.4
Pecht, M.G.5
Tsagos, D.6
-
12
-
-
0036457876
-
An integrated approach to flow, thermal and mechanical modeling of electronics devices
-
San Diego, CA, 2002
-
J. Parry, C. Marooney, M. Warner, C. Bailey, K. Pericleous,"An integrated approach to flow, thermal and mechanical modeling of electronics devices,"ITherm 2002, p 862-8, San Diego, CA., 2002
-
(2002)
ITherm
, pp. 862-868
-
-
Parry, J.1
Marooney, C.2
Warner, M.3
Bailey, C.4
Pericleous, K.5
-
13
-
-
84928634871
-
-
[Online], 08/06/2007
-
[Online] http://www.icepak.com, 08/06/2007.
-
-
-
-
14
-
-
0343480506
-
Integrated durability design tool for electronics packaging
-
M. Rassaian, J.C. Lee, D.W. Twigg,"Integrated durability design tool for electronics packaging,"Advances in Electronic Packaging 1997. Proceedings of the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference. INTERpack '97, 1997, pt. 1, 911-18 vol.1
-
(1997)
Advances in Electronic Packaging 1997. Proceedings of the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference INTERpack '97
, vol.1
, pp. 911-918
-
-
Rassaian, M.1
Lee, J.C.2
Twigg, D.W.3
-
15
-
-
0025550913
-
-
IEEE Transactions on Components, Hybrids, and Manufacturing Technology, December
-
W. Engelmaier,"The Use Environments of Electronic Assemblies and Their Impact on Surface Mount Solder Attachment Reliability,"IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 13, Issue 4, pp. 903-908, December 1990
-
(1990)
The Use Environments of Electronic Assemblies and Their Impact on Surface Mount Solder Attachment Reliability
, vol.13
, Issue.4
, pp. 903-908
-
-
Engelmaier, W.1
-
16
-
-
0347663574
-
Fatigue life assessment of bump type solder joint under vibration environment
-
S. B. Lee and S. J. Ham,"Fatigue Life Assessment of Bump Type Solder Joint Under Vibration Environment,"ASME 1999 Advances in Electronic Packaging, Vol. 26, Issue 1, pp 699-704, 1999
-
(1999)
ASME 1999 Advances in Electronic Packaging
, vol.26
, Issue.1
, pp. 699-704
-
-
Lee, S.B.1
Ham, S.J.2
-
17
-
-
0038689228
-
Fatigue life models for SnAgCu and SnPb solder joints evaluated by experiments and simulation
-
New Orleans, LA
-
A. Schubert et. al.,"Fatigue life models for SnAgCu and SnPb solder joints evaluated by experiments and simulation", ECTC, New Orleans, LA., 2003.
-
(2003)
ECTC
-
-
Schubert, A.1
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