In situ temperature measurement of a notebook computer - A case study in health and usage monitoring of electronics

IEEE Transactions on Device and Materials Reliability

Volumn 4, Issue 4, 2004, Pages 658-663

  Vichare, Nikhil ^a   Rodgers, Peter ^a   Eveloy, Valérie ^a   Pecht, Michael G ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

Electronics cooling; Health monitoring; In situ monitoring; Notebook computer; Reliability prediction; Temperature measurement; Thermal characterization

Indexed keywords

ATMOSPHERIC HUMIDITY; COOLING; HEAT SINKS; LIFE CYCLE; RELIABILITY; TEMPERATURE MEASUREMENT;

ELECTRONICS COOLING; HEALTH MONITORING; IN SITU MONITORING; RELIABILITY PREDICTION; THERMAL CHARACTERIZATION;

LAPTOP COMPUTERS;

EID: 13444256234     PISSN: 15304388     EISSN: None     Source Type: Journal    
DOI: 10.1109/TDMR.2004.838403     Document Type: Article

References (38)

1. M. Pecht, D. Das, and A. Ramakrishnan, "The IEEE standards on reliability program and reliability prediction methods for electronic equipment," Microelectron. Reliabil., vol. 42, pp. 1259-1266, 2002.
2. A. Ramakrishnan and M. Pecht, "A life consumption monitoring methodology for electronic systems," IEEE Trans. Compon. Packag. Technol., vol. 26, no. 3, pp. 625-634, Sep. 2003.
3. S. Mishra, M. Pecht, T. Smith, I. McNee, and R. Harris, "Remaining life prediction of electronic products using life consumption monitoring approach," in Proc. Eur. Microelectronics Packaging and Interconnection Symp., Cracow, Poland, Jun. 2002, pp. 136-142.
4. P. Lall, M. Pecht, and E. Harkim, Influence of Temperature on Microelectronics and System Reliability. New York: CRC Press, 1997.
5. A. Dasgupta, "The physics-of-failure approach at the University of Maryland for the development of reliable electronics," in Proc. 3rd Int. Conf. Thermal and Mechanical Simulation in (Micro)Electronics (EuroSimE), 2002, pp. 10-17.
6. R. K. Kirschman, "Low temperature electronics," IEEE Circuits Dev. Mag., pt. 2, vol. 6, pp. 12-24, 1990.
7. J. D. Parry, J. Rantala, and C. J. M. Lasance, "Enhanced electronic system reliability - challenges for temperature prediction," IEEE Trans. Compon. Packag. Technol., vol. 25, no. 4, pp. 533-538, Dec. 2002.
8. D. Searls, T. Dishongh, and P. Dujari, "A Strategy for enabling data driven product decisions through a comprehensive understanding of the usage environment," presented at the Pacific RIM/ASME International Intersociety Electronic and Photonic Packaging Conf. (IPACK '01) - Advances in Electronic Packaging, Kauai, HI, Jul. 2001.
9. K. Skadron, "A computer-architecture approach to thermal management in computer systems: challenges and opportunities," in Proc. 5th Int. Conf. Thermal and Mechanical Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Brussels, Belgium, May 2004, pp. 415-422.
10. _, "The importance, of computer architecture in microprocessor thermal design," in Proc. 9th Intersociety Conf. Thermal and Thermomechanical Phenomena in Electronics Systems (ITHERM), Las Vegas, NV, Jun. 2004, pp. 729-730.
11. A. Bar-Cohen and M. Iyengar, "Least-energy optimization of air-cooled heat sinks for sustainable development," IEEE Trans. Compon. Packag. Technol., vol. 26, no. 1, pp. 16-25, Mar. 2003.
12. W. K. Coxe, G. L. Solbrekken, K. Yazawa, and A. Bar-Cohen, "Experimental modeling of the passive cooling limit of notebook computers," in Proc. 8th Intersociety Conf. Thermal and Thermomechanical Phenomena in Electronics Systems (ITHERM), 2002, pp. 15-21.
13. T. Kobayashi, T. Ogushi, N. Sumi, and M. Fujii, "Thermal design of a ultra-slim notebook computer," in Proc. 6th Intersociety Conf. Thermal and Thermomechanical Phenomena in Electronics Systems (ITHERM), 1998, pp. 15-21.
14. H. Xie, A. Ali, and R. Bhatia, "The use of heat pipes in personal computers," in Proc. 6th Intersociety Conf. Thermal and Thermomechanical Phenomena in Electronics Systems (ITHERM), 1998, pp. 442-455.
15. M. Saini and R. L. Webb, "Heat rejection limits of air cooled plane fin heat sinks for computer cooling," in Proc. 8th Intersociety Conf. Thermal and Thermomechanical Phenomena in Electronics Systems (ITHERM), 2002, pp: 1-8.
16. T. Nguyen, M. Mochizuki, K. Mashiko, Y. Saito, I. Sauciuc, and R. Boggs, "Advanced cooling system using miniature heat pipes in mobile PC," in Proc. 6th Intersociety Conf. Thermal and Thermomechanical Phenomena in Electronics Systems (ITHERM), 1998, pp. 507-511.
17. J. S. Campbell, W. Z. Black, A. Glezer, and J. G. Hartley, "Thermal management of a notebook computer with synthetic air microjets," in Proc. 6th Intersociety Conf. Thermal and Thermomechanical Phenomena in Electronics Systems (ITHERM), 1998, pp. 43-50.
18. J. R. Guarino and V. P. Manno, "Characterization of laminar jet impingement cooling in portable computer applications," in Proc. 17th IEEE Semiconductor Thermal Measurement and Management Symp. (SEMI-THERM XVII), 2001, pp. 1-11.
19. G. L. Solbrekken, K. Yazawa, and A. Bar-Cohen, "Thermal management of portable electronic equipment using thermoelectric energy conversion," in Proc. 9th Intersociety Conf. Thermal and Thermomechanical Phenomena in Electronics Systems (ITHERM), 2004, pp. 276-283.
20. O. Suzuki, "Design and manufacturing challenges of liquid heat sink for next generation liquid cooling," presented at the JSME Project Meeting, Design and Manufacturing of High Performance Heat Sinks for Microelectronic Equipment, Tokyo, Japan, Oct. 2003.
21. C. J. M. Lasance, "The European project profit: prediction of temperature gradients influencing the quality of electronic products," in Proc. 17th IEEE Semiconductor Thermal and Temperature Measurement Symp. (SEMI-THERM XVII), 2001, pp. 120-125.
22. P. Rodgers, V. Eveloy, and M. Davies, "An experimental assessment of numerical predictive accuracy for electronic component heat transfer in forced convection: Parts I and II," Trans. ASME, J. Electron. Packag., vol. 125, no. 1, pp. 67-83, 2003.
23. V. Eveloy, P. Rodgers, and M. S. J. Hashmi, "Numerical prediction of electronic component operational temperature: a perspective," IEEE Trans. Compon. Packag. Technol., vol. 27, no. 2, pp. 268-282, Jun. 2004.
24. C. J. M. Lasance, "The need for a change in thermal design philosophy," Electron. Cooling, vol. 1, no. 2, pp. 24-26, 1995.
25. A. Ramakrishnan and M. Pecht, "Load characterization during transportation," Microelectron. Reliabil., vol. 44, no. 2, pp. 333-338, January 2004.
26. J. Xie and M. Pecht, "Application of in situ health monitoring and prognostic sensors," presented at the 9th Pan Pacific Microelectronics Symposium Exhibits and Conf., Oahu, HI, Feb. 2004.
27. PC Guide (2004). [Online]. Available: http://www.pcguide.com/ref/hdd/perf/qual/featuresSMART-c.html
28. Intel Pentium II Processor Thermal Management (2004). [On-line]. Available: http://www.intel.com/support/processors/pentiumii/1793.htm
29. R. M. Wetzel, Fatigue Under Complex Loading: Analysis and Experiments. Warrendale, PA: Soc. Automotive Eng. Inc., 1977.
30. H. Anzai, "Algorithm of rainflow method," in The Rainflow Method in Fatigue. Oxford, U.K.: Butterworth-Heinmann, 1991, pp. 11-20.
31. P. Sharma and A. Dasgupta, "Micro-mechanics of creep-fatigue damage in PB-SN solder due to thermal cycling - Part II: mechanistic insights and cyclic durability predictions from monotonic data," Trans. ASME, J. Electron. Packag., vol. 124, no. 3, pp. 298-304, 2002.
32. C. Zhai, C. Sidharth, and R. Blish, "Board level solder reliability versus ramp rate and dwell time during temperature cycling," IEEE Trans. Device Materials Reliab., vol. 3, no. 4, pp. 207-212, Dec. 2003.
33. R. Mahajan, C. P. Chiu, and R. Prasher, "Thermal interface materials: a brief review of design characteristics and materials," Electron. Cooling, vol. 10, no. 1, pp. 10-18, 2004.
34. IPC-SM-785 - Guidelines for Accelerated Reliability Testing of Surface Mount Attachments (1992, Nov.). [Online]. Available: http://www.ipc.org
35. S. Bosworth, S. C. Hsu, and J. Polcari, "Exceptional performance from the development, qualification, and implementation of a silicone adhesive for bonding heatsinks to semiconductor packages," IEEE Trans. Compon., Packag. Manufact. Technol. - Part A, vol. 18, no. 1, pp. 94-100, 1995.
36. M. F. Ben Achour and A. Bar-Cohen, "Mechanical stress reduction in heat sink bond layers - a numerical feasibility study," in Proc. Electronic Components Technology Conf. (ECTC), 1999, pp. 307-315.
37. A. Kaisare, Z. Han, D. Agonafer, and K. Ramakrishna, "Prediction of effect of heat sink adhesive on mechanical reliability of a wire bonded plastic ball grid array package," in Proc. 8th Intersociety Conf. Thermal and Thermomechanical Phenomena in Electronics Systems (ITHERM 2002), 2002, pp. 926-931.
38. V. Eveloy, P. Rodgers, and M. Pecht, "Reliability of pressure sensitive adhesive tapes for heat sink attachment in air-cooled electronic assemblies," IEEE Trans. Device Materials Reliab., vol. 4, no. 4, pp. 650-657, Dec. 2004.