Fatigue crack growth and life descriptions of Sn3.8Ag0.7Cu solder joints: A computational and experimental study

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 558-565

  Bhate, D ^a   Chan, D ^a   Subbarayan, G ^a   Nguyen, L ^b  

^a Purdue University   (United States)

^b NATIONAL SEMICONDUCTOR CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COHESIVE ZONE MODELS; COHESIVE ZONE THEORY; FRACTURE PARAMETERS; INELASTIC STRAINS;

CRACK TIPS; FATIGUE CRACK PROPAGATION; FINITE ELEMENT METHOD; FRACTURE MECHANICS; PARAMETER ESTIMATION; THERMAL CYCLING; WEIBULL DISTRIBUTION;

SOLDERED JOINTS;

EID: 35348837204     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373851     Document Type: Conference Paper

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