Generalized multi-domain method for fatigue analysis of interconnect structures

Finite Elements in Analysis and Design

Volumn 40, Issue 7, 2004, Pages 793-805

  Rassaian, Mostafa ^a   Lee, Jung Chuan ^a  

^a BOEING COMPANY   (United States)

Author keywords

Ball grid array (BGA); Ceramic chip carrier (CCC); Electronic packaging; Fatigue; Finite element method (FEM); Leaded device; Multi domain method (MDM); Plated through hole (PTH); Solder joints

Indexed keywords

CHIP SCALE PACKAGES; CONVERGENCE OF NUMERICAL METHODS; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; INTEGRATED CIRCUIT LAYOUT; INTERPOLATION; POLYNOMIALS; PROBLEM SOLVING; SOLDERED JOINTS; STRESS ANALYSIS; STRESS CONCENTRATION; THERMAL CYCLING;

BALL GRID ARRAY (BGA); CERAMIC CHIP CARRIER (CCC); LEADED DEVICES; MULTI-DOMAIN METHOD (MDM); PLATED-THROUGH HOLE (PTH);

ELECTRIC CONNECTORS;

EID: 1142288422     PISSN: 0168874X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0168-874X(03)00115-X     Document Type: Article

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