메뉴 건너뛰기




Volumn , Issue , 2007, Pages

Real-time detection of solder-joint faults in operational field programmable gate arrays

Author keywords

[No Author keywords available]

Indexed keywords

BALL GRID ARRAYS; FAILURE ANALYSIS; REAL TIME CONTROL; SOLDERED JOINTS;

EID: 34548727929     PISSN: 1095323X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/AERO.2007.352914     Document Type: Conference Paper
Times cited : (12)

References (17)
  • 1
    • 34548735358 scopus 로고    scopus 로고
    • XILINX Fine-Pitch BGA (FG1156/FGG1156) Package, PK039 (v1.2), June 25, 2004.
    • XILINX Fine-Pitch BGA (FG1156/FGG1156) Package, PK039 (v1.2), June 25, 2004.
  • 2
    • 34548723940 scopus 로고    scopus 로고
    • Accelerated Reliability Task IPC-SM-785, SMT Force Group Standard, Product Reliability Committee of the IPC, Published by Analysis Tech., Inc., 2005, www.analysistech.com/event-tech-IPC-SM-785.
    • Accelerated Reliability Task IPC-SM-785, SMT Force Group Standard, Product Reliability Committee of the IPC, Published by Analysis Tech., Inc., 2005, www.analysistech.com/event-tech-IPC-SM-785.
  • 3
    • 4444235973 scopus 로고    scopus 로고
    • Pradeep. Lall, M.N. Islam, N. Singh, J.C. Suhling and R. Darveaux, Model for BGA and CSP Reliability in Automotive Underhood Applications, IEEE Trans. Comp, and Pack. Tech. 27, No. 3, Sep. 2004.
    • Pradeep. Lall, M.N. Islam, N. Singh, J.C. Suhling and R. Darveaux, "Model for BGA and CSP Reliability in Automotive Underhood Applications," IEEE Trans. Comp, and Pack. Tech. Vol. 27, No. 3, Sep. 2004.
  • 5
    • 34548714714 scopus 로고    scopus 로고
    • Sony Semiconductor Quality and Reliability Handbook, http://www.sony.net/ products/SC-HP/tec/catalog, 2 and 4, Revised May 2001.
    • Sony Semiconductor Quality and Reliability Handbook, http://www.sony.net/ products/SC-HP/tec/catalog, Vol. 2 and Vol. 4, Revised May 2001.
  • 6
    • 34548727444 scopus 로고    scopus 로고
    • Use Condition Based Reliability Evaluation: An Example Applied to Ball Grid Array (BGA) Packages, SEMATECH Technology Transfer #99083813A-XFR, International SEMATECH, 1999.
    • Use Condition Based Reliability Evaluation: An Example Applied to Ball Grid Array (BGA) Packages, SEMATECH Technology Transfer #99083813A-XFR, International SEMATECH, 1999.
  • 7
    • 34548770104 scopus 로고    scopus 로고
    • Comparison of Ball Grid Array (BGA) Component and Assembly Level Qualification Tests and Failure Modes, SEMATECH Technology Transfer #00053957A-XFR, International SEMATECH, May 31, 2000.
    • Comparison of Ball Grid Array (BGA) Component and Assembly Level Qualification Tests and Failure Modes, SEMATECH Technology Transfer #00053957A-XFR, International SEMATECH, May 31, 2000.
  • 10
    • 34548798132 scopus 로고    scopus 로고
    • The Reliability Report, XILINX, xgoogle.xilinx.com, Sep. 1, 2003.
    • The Reliability Report, XILINX, xgoogle.xilinx.com, Sep. 1, 2003.
  • 14
    • 32844459679 scopus 로고    scopus 로고
    • Leading Indicators of Failure for Prognostication of Leaded and Lead-Free Electronics in Harsh Environments
    • San Francisco, CA, Paper IPACK2005-73426, July 17-22
    • Pradeep Lall, N. Islam and J. Suhling, "Leading Indicators of Failure for Prognostication of Leaded and Lead-Free Electronics in Harsh Environments," Proceedings of the ASME InterPACK Conference, San Francisco, CA, Paper IPACK2005-73426, July 17-22, 2005.
    • (2005) Proceedings of the ASME InterPACK Conference
    • Pradeep Lall, N.I.1    Suhling, J.2
  • 17
    • 43549097875 scopus 로고    scopus 로고
    • Insitu, real-time detector for faults in solder joint networks belonging to operational, fully programmed field programmable gate arrays (FPGAs)
    • Anaheim, CA, Sep. 18-21
    • James Hofmeister, Pradeep Lall, Russell Graves, "Insitu, real-time detector for faults in solder joint networks belonging to operational, fully programmed field programmable gate arrays (FPGAs)," Proceedings of the IEEE AUTOTESTCON 2006, Anaheim, CA, Sep. 18-21, 2006.
    • (2006) Proceedings of the IEEE AUTOTESTCON 2006
    • Hofmeister, J.1    Lall, P.2    Graves, R.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.