3D CMOS-memristor hybrid circuits: Devices, integration, architecture, and applications

Proceedings of the International Symposium on Physical Design

Volumn , Issue , 2012, Pages 33-40

  Cheng, Kwang Ting ^a   Strukov, Dmitri B ^a  

^a Santa Barbara   (United States)

Author keywords

3D integration; Memristors

Indexed keywords

3-D INTEGRATION; 3D CIRCUIT; CMOS TECHNOLOGY; COMPACT ELECTRONICS; HIGH DENSITY; HIGH FLEXIBILITY; HYBRID CIRCUIT; INTER-LAYER COMMUNICATION; MEMORY DENSITY; NANO-DEVICES; RESEARCH EFFORTS; THROUGH SILICON VIAS;

CMOS INTEGRATED CIRCUITS; INTEGRATION; MEMRISTORS; NANOSTRUCTURED MATERIALS; NANOWIRES; PASSIVE FILTERS; RESISTORS; TELECOMMUNICATION SYSTEMS;

THREE DIMENSIONAL;

EID: 84860227837     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1145/2160916.2160925     Document Type: Conference Paper

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