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Volumn 96, Issue , 2012, Pages 82-91

Microstructure, orientation and damage evolution in SnPb, SnAgCu, and mixed solder interconnects under thermomechanical stress

Author keywords

Microstructure; Orientation; Soldering; Thermomechanical fatigue

Indexed keywords

ACCUMULATED DAMAGE; CRACK PATHS; CRYSTALLOGRAPHIC ORIENTATIONS; DAMAGE EVOLUTION; DWELL TIME; ELECTRON BACK-SCATTERED DIFFRACTION; ENHANCED DIFFUSION; INTERGRANULAR CRACKING; LOW ANGLE GRAIN BOUNDARIES; RECRYSTALLIZED GRAINS; RECRYSTALLIZED MICROSTRUCTURES; SN GRAINS; SNAGCU SOLDER; SNPB SOLDER; SOLDER INTERCONNECTS; STRAIN CONCENTRATION; SUBGRAINS; THERMO MECHANICAL FATIGUES (TMF); THERMO-MECHANICAL STRESS; VICKERS MICROHARDNESS;

EID: 84859934560     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2012.03.005     Document Type: Article
Times cited : (44)

References (33)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.