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Volumn 96, Issue , 2012, Pages 82-91
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Microstructure, orientation and damage evolution in SnPb, SnAgCu, and mixed solder interconnects under thermomechanical stress
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Author keywords
Microstructure; Orientation; Soldering; Thermomechanical fatigue
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Indexed keywords
ACCUMULATED DAMAGE;
CRACK PATHS;
CRYSTALLOGRAPHIC ORIENTATIONS;
DAMAGE EVOLUTION;
DWELL TIME;
ELECTRON BACK-SCATTERED DIFFRACTION;
ENHANCED DIFFUSION;
INTERGRANULAR CRACKING;
LOW ANGLE GRAIN BOUNDARIES;
RECRYSTALLIZED GRAINS;
RECRYSTALLIZED MICROSTRUCTURES;
SN GRAINS;
SNAGCU SOLDER;
SNPB SOLDER;
SOLDER INTERCONNECTS;
STRAIN CONCENTRATION;
SUBGRAINS;
THERMO MECHANICAL FATIGUES (TMF);
THERMO-MECHANICAL STRESS;
VICKERS MICROHARDNESS;
COALESCENCE;
CRACKS;
CRYSTAL ORIENTATION;
GRAIN BOUNDARIES;
LEAD;
LEAD COMPOUNDS;
MICROSTRUCTURE;
RECRYSTALLIZATION (METALLURGY);
SCANNING ELECTRON MICROSCOPY;
SOLDERING;
SOLDERING ALLOYS;
THERMAL CYCLING;
TIN;
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EID: 84859934560
PISSN: 01679317
EISSN: None
Source Type: Journal
DOI: 10.1016/j.mee.2012.03.005 Document Type: Article |
Times cited : (44)
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References (33)
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