Microstructural analysis of reballed tin-lead, lead-free, and mixed ball grid array assemblies under temperature cycling test

Journal of Electronic Materials

Volumn 39, Issue 8, 2010, Pages 1218-1232

  Nie, Lei ^a   Mueller, Maik ^b   Osterman, Michael ^a   Pecht, Michael ^a  

^a UNIVERSITY OF MARYLAND   (United States)

^b DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

Failure analysis; Reballed BGA; Reliability; Sn Ag Cu; Sn Pb; Temperature cycling

Indexed keywords

BALL GRID ARRAY PACKAGES; BULK SOLDER; LEAD-FREE; LEAD-FREE ASSEMBLY; MICROSTRUCTURAL ANALYSIS; MIXED ASSEMBLIES; SN-3.0AG-0.5CU; SN-37PB; SN-AG-CU; SOLDER BALLS; TEMPERATURE CYCLING; TEMPERATURE CYCLING TESTS; TEMPERATURE RANGE; TIN-LEAD;

BALL GRID ARRAYS; FAILURE ANALYSIS; LEAD; QUALITY ASSURANCE; RELIABILITY ANALYSIS; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; SPHERES; TIN ALLOYS; TITANIUM COMPOUNDS;

TIN;

EID: 77954623518     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-010-1209-1     Document Type: Article

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