Solder joint characteristics and reliability of lead-free area array packages assembled at various tin-lead soldering process conditions

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 31, Issue 3, 2008, Pages 227-239

  Nguyen, Jennifer ^a   Geiger, David ^a   Rooney, Daniel ^a   Shangguan, Dongkai ^a  

^a FLEXTRONICS INTERNATIONAL   (United States)

Author keywords

Backward compatibility; Backward compatible assembly; Bend test; Drop test; Lead free; Mechanical shock environment; Mixed alloy; Reflow temperature; Reliability; Shear test; SnAgCu alloy; Thermal cycle test; Thermal shock environment

Indexed keywords

ALLOYS; BRAZING; CHEMICAL ENGINEERING; LEAD; METALLIC COMPOUNDS; METALLURGY; ORES; SMELTING; SOLDERING; STRESSES; THEOREM PROVING; TITANIUM COMPOUNDS; WELDING;

ARRAY PACKAGES; COMPOSITIONAL HOMOGENEITY; CRITICAL PROCESS CONDITIONS; ENVIRONMENTAL LOADINGS; LEAD FREE; MECHANICAL STRESSING; PROCESS CONDITIONS; REFLOW TEMPERATURES; SOLDER JOINTS; SOLDER PASTES; SOLDERING PROCESSES;

TIN;

EID: 47249165238     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2008.926282     Document Type: Article

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