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Volumn 39, Issue 12, 2010, Pages 2669-2679
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Crack development in a low-stress PBGA package due to continuous recrystallization leading to formation of orientations with [001] parallel to the interface
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Author keywords
continuous recrystallization; Crystal orientation; thermomechanical fatigue; tin
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Indexed keywords
CONTINUOUS RECRYSTALLIZATION;
CRACK DEVELOPMENT;
CRACKED JOINTS;
DWELL TIME;
HIGHLY-CORRELATED;
INITIAL ORIENTATION;
LARGE STRAINS;
LOW STRESS;
ORIENTATION IMAGING MICROSCOPY;
PACKAGE DESIGNS;
PACKAGE INTERFACES;
PLASTIC BALL GRID ARRAYS;
RECRYSTALLIZED GRAINS;
SOLDER JOINTS;
THERMOMECHANICAL FATIGUE;
CRACKS;
CRYSTAL MICROSTRUCTURE;
DIES;
ELECTRONICS PACKAGING;
PACKAGING;
RECRYSTALLIZATION (METALLURGY);
THERMAL CONDUCTIVITY;
TIN;
CRYSTAL ORIENTATION;
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EID: 78049499032
PISSN: 03615235
EISSN: None
Source Type: Journal
DOI: 10.1007/s11664-010-1380-4 Document Type: Conference Paper |
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Times cited : (56)
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References (15)
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