SCOPUS 정보 검색 플랫폼

Volumn 16, Issue 5, 2001, Pages 1227-1230

Stability of channels at a scalloplike Cu6Sn5 layer in solder interconnections

Author keywords

[No Author keywords available]

Indexed keywords

BACKSCATTERING; ELECTRON DIFFRACTION; GRAIN BOUNDARIES; INTERMETALLICS; SOLDERING; SOLDERING ALLOYS; SUBSTRATES; THERMODYNAMIC STABILITY;

SOLDER INTERCONNECTIONS;

COPPER COMPOUNDS;

EID: 0035352082 PISSN: 08842914 EISSN: None Source Type: Journal
DOI: 10.1557/JMR.2001.0169 Document Type: Article

Times cited : (31)

References (23)

4
- 0003816374
- Van Nostrand Reinhold, New York
- (1994) Solder Joint Reliability , pp. 93
- Lau, J.H.¹

5
- 0003831179
- Electrochemical Publications Ltd., Ayr, Scotland
- (1989) Soldering in Electronics, 2nd ed.
- Klein Wassink, R.J.¹

6
- 0016550015
- (1975) Trans. JIM , vol.16 , pp. 539
- Onishi, M.¹ Fujibuchi, H.²

7
- 0020125253
- (1982) Acta Metall. , vol.30 , pp. 947
- Tu, K.N.¹ Thompson, R.D.²

14
- 0031352334
- Design & reliability of solders and solder interconnections
- edited by R.K. Mahidhara, D.R. Frear, S.M.L. Sastry, K.L. Murty, P.K. Liaw, and W.L. Winterbottom, Orlando, FL
- (1997) Proceedings of a Symposium held during the TMS Annual Meeting , pp. 161
- Vianco, P.T.¹ Hopkins, P.L.² Erickson, K.L.³ Frear, D.R.⁴ Davidson, R.⁵

15
- 0031332168
- Design & reliability of solders and solder interconnections
- edited by R.K. Mahidhara, R.D. Frear, S.M.L. Sastry, K.L. Murty, P.K. Liaw, and W.L. Winterbottom, Orlando, FL
- (1997) Proceedings of a Symposium held during the TMS Annual Meeting , pp. 247
- Schaefer, M.¹ Laub, W.² Fournelle, R.A.³ Liang, J.⁴

21
- 21544455325
- (1995) Appl. Phys. Lett. , vol.67 , pp. 2002
- Kim, H.K.¹ Tu, K.N.²

23
- 0022771896
- (1986) Brazing Soldering , vol.11 , pp. 49
- London, J.¹ Ashall, D.W.²

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.