Suppressing intermetallic compound growth in SnAgCu solder joints with addition of carbon nanotubes

2008 2nd IEEE International Nanoelectronics Conference, INEC 2008

Volumn , Issue , 2008, Pages 15-19

  Nai, S M L ^a   Gupta, M ^a   Wei, J ^b  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ARSENIC COMPOUNDS; BRAZING; CHLORINE COMPOUNDS; ELECTRONICS ENGINEERING; INTERMETALLICS; METALLIC MATRIX COMPOSITES; METALS; MULTIWALLED CARBON NANOTUBES (MWCN); NANOCOMPOSITES; NANOELECTRONICS; NANOPORES; NANOSTRUCTURED MATERIALS; NANOSTRUCTURES; NANOTECHNOLOGY; NANOTUBES; SEMICONDUCTING INTERMETALLICS; SOLDERING; SOLDERING ALLOYS; WELDING;

COMPOSITE SOLDERS; DIFFUSION CO-EFFICIENT; IMC THICKNESS; INTERMETALLIC COMPOUND; INTERMETALLIC COMPOUND GROWTH; ISOTHERMAL AGEING; MULTI-WALLED CARBON NANOTUBES; SN-AG-CU SOLDER; SOLDER JOINTS;

CARBON NANOTUBES;

EID: 52649123391     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/INEC.2008.4585428     Document Type: Conference Paper

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