Morphology and growth kinetics of Ag3Sn during soldering reaction between liquid Sn and an Ag substrate

Journal of Materials Engineering and Performance

Volumn 11, Issue 4, 2002, Pages 365-368

  Su, T L ^a   Tsao, L C ^a   Chang, S Y ^a   Chuang, T H ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

Ag3Sn intermetallic compound; Interfacial reaction; Kinetic analysis; Target bonding

Indexed keywords

ACTIVATION ENERGY; GROWTH KINETICS; MORPHOLOGY; SILVER COMPOUNDS; SOLDERING; SPUTTERING; SUBSTRATES; SURFACE REACTIONS; TIN;

TARGET BONDING;

INTERMETALLICS;

EID: 0036692934     PISSN: 10599495     EISSN: None     Source Type: Journal    
DOI: 10.1361/105994902770343872     Document Type: Article

References (11)

1. Solder alloy and soldering processes for flux-free soldering of difficult-to-wet materials
2. Room temperature interactions in Ag-metals thin film couples
3. Kinetics of reaction at room-temperature in thin silver metal couples
4. Stability of compounds in thin-metal couples in the course of long aging at room-temperature
5. Effect of Sn content of Pb-Sn solder alloys on wetting dynamics
6. Silver-palladium metallisation interactions with reflowed solder pastes
7. Interface reaction between Ag-Pd conductor and Pd-Sn solder
8. Interactions between silver-palladium metallization tin-lead-silver solder
9. Diffusion in solid metals and alloys