Pulse electroplating of Sn-Bi alloys on micropatterned electrodes for lead-free solder bumping

Journal of the Electrochemical Society

Volumn 159, Issue 2, 2012, Pages

  Tsai, Yi Da ^a   Yu, Chi Yang ^a   Hu, Chi Chang ^a   Duh, Jenq Gong ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITION VARIATION; CU-NI SUBSTRATES; DENDRITE FORMATION; EDGE EFFECT; EDGE REGION; ETHYLENEDIAMINETETRAACETIC ACID; LEAD FREE SOLDERS; MICROPATTERNED; PEG-400; PULSE DEPOSITION; PULSE ELECTROPLATING; PULSE FREQUENCIES; PULSE PLATING; SCANNING ELECTRON MICROSCOPIC; SN-BI ALLOY;

BINARY ALLOYS; CITRIC ACID; DEPOSITS; ELECTROPLATING; ETHYLENE; ETHYLENE GLYCOL; POLYIMIDES; TIN ALLOYS;

TIN;

EID: 84855301640     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/2.083202jes     Document Type: Article

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