Shape evolution of electrodeposited copper bumps

Journal of the Electrochemical Society

Volumn 143, Issue 6, 1996, Pages 1880-1886

  Kondo, Kazuo ^a,b   Fukui, Keisuke ^c   Uno, Katsumasa ^b   Shinohara, Kunio ^b  

^a ELECTROCHEMICAL SOCIETY

^b HOKKAIDO UNIVERSITY   (Japan)

^c UNIVERSITY OF HYOGO   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CALCULATIONS; COMPUTATIONAL FLUID DYNAMICS; ELECTRODEPOSITION; FLOW PATTERNS; SCANNING ELECTRON MICROSCOPY; VORTEX FLOW;

COPPER BUMPS; DOT DIAMETERS; FLUX PROFILES; PECLET NUMBERS; PENETRATION FLOW; SHAPE EVOLUTION; VORTEX EVOLUTION;

COPPER;

EID: 0030165126     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1836919     Document Type: Article

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