Electrodeposition of Pb-free Sn alloys in pulsed current

Applied Surface Science

Volumn 252, Issue 10, 2006, Pages 3561-3573

  Neveu, B ^a   Lallemand, F ^a,b   Poupon, G ^c   Mekhalif, Z ^b  

^a Lab de Chim des Mat et Interfaces   (France)

^b UNIVERSITY OF NAMUR   (Belgium)

^c CEA LETI   (France)

Author keywords

Electroplating; Organic additives; Pulse plating; Sn Ag eutectic alloy

Indexed keywords

ELECTRIC CURRENTS; ELECTROCHEMISTRY; ELECTROLYTIC REDUCTION; ELECTROPLATING; EUTECTICS; LEAD; SILVER ALLOYS; SOLDERING ALLOYS; X RAY PHOTOELECTRON SPECTROSCOPY;

ELECTROCHEMICAL REDUCTION; ORGANIC ADDITIVES; PULSE PLATING;

TIN ALLOYS;

EID: 32644434972     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2005.05.024     Document Type: Article

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