Anomalous growth of whisker-like bismuth-tin extrusions from tin-enriched tin-Bi deposits

Journal of Alloys and Compounds

Volumn 472, Issue 1-2, 2009, Pages 121-126

  Hu, Chi Chang ^a   Tsai, Yi Da ^b   Lin, Chi Cheng ^b   Lee, Gen Lan ^b   Chen, Sinn Wen ^a   Lee, Tai Chou ^b   Wen, Ten Chin ^c  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b NATIONAL CHUNG CHENG UNIVERSITY   (Taiwan)

^c NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Electroplating; Lead free solder; Metal extrusion; Post plating annealing; Sn xBi deposit

Indexed keywords

ALLOYS; ANNEALING; BISMUTH; BRAZING; ELECTROCHEMISTRY; ELECTRONICS INDUSTRY; LEAD; MELTING POINT; METAL ANALYSIS; METAL EXTRUSION; METALS; SMELTING; SOLDERED JOINTS; THERMAL EXPANSION; TIN ALLOYS; TIN DEPOSITS; TITANIUM COMPOUNDS; WELDING;

ANNEALING TEMPERATURES; ELECTRONIC PRODUCTS; LEAD-FREE SOLDER; LOW MELTING POINTS; POST-PLATING ANNEALING; PURE METALS; SEM OBSERVATIONS; SN ALLOYS; SN GRAINS; SN WHISKERS; SN-XBI DEPOSIT;

TIN;

EID: 61349179663     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2008.04.094     Document Type: Article

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