Composition and microstructure control of tin-bismuth alloys in the pulse plating process

Journal of the Electrochemical Society

Volumn 158, Issue 8, 2011, Pages

  Tsai, Yi Da ^a   Hu, Chi Chang ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CHARGING EFFECT; DEPOSITION POTENTIAL; DOUBLE LAYERS; ETHYLENEDIAMINETETRAACETIC ACID; MASS-TRANSPORT PROCESS; MICROSTRUCTURE CONTROL; PEG-400; PULSE CYCLE; PULSE FREQUENCIES; PULSE PLATING; PULSE PLATING PROCESS; SCANNING ELECTRON MICROSCOPIC; SN-BI ALLOY; VOLTAMMETRIC;

ALLOYS; BISMUTH; BISMUTH ALLOYS; BISMUTH COMPOUNDS; CITRIC ACID; DEPOSITS; ELECTROPLATING; GLYCOLS; POLYETHYLENE GLYCOLS; PROCESS CONTROL; TIN ALLOYS; X RAY DIFFRACTION; X RAY DIFFRACTION ANALYSIS;

TIN;

EID: 80051715221     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3594733     Document Type: Article

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