Electrodeposition of Sn-Bi lead-free solders: Effects of complex agents on the composition, adhesion, and dendrite formation

Electrochimica Acta

Volumn 53, Issue 4, 2007, Pages 2040-2047

  Tsai, Yi Da ^b   Hu, Chi Chang ^a,b   Lin, Chi Cheng ^b  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b NATIONAL CHUNG CHENG UNIVERSITY   (Taiwan)

Author keywords

Complex agent; Electrodeposition; Lead free solder; Linear sweep voltammetry; Sn Bi alloy

Indexed keywords

ADHESION; BISMUTH; CHEMICAL ANALYSIS; CITRIC ACID; ELECTRODEPOSITION; ETHYLENE; SOLDERING ALLOYS; VOLTAMMETRY;

COMPLEX AGENT; DENDRITE FORMATION; ETHYLENEDIAMINETETRAACETIC ACID (EDTA); LEAD-FREE SOLDER; LINEAR SWEEP VOLTAMMETRY;

TIN;

EID: 35548958627     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2007.09.002     Document Type: Article

References (33)

1. Tanimoto M., Tanaka H., Suzuki S., and Matsuda A. Furukawa Electric Rev. 19 (2000) 91
2. Fukuda M., Imayoshi K., and Matsumoto Y. Electrochim. Acta 47 (2001) 459
3. Suh M.S., Park C.J., and Kwon H.S. Surf. Coat. Technol. 200 (2006) 3527
4. Davis E.M., Harding W.E., Schwartz R.S., and Corning J.J. IBM J. Res. Develop. (1964) 102
5. Neveu B., Lallemand F., Poupon G., and Mekhalif Z. Appl. Surf. Sci. 252 (2006) 3561
6. Bigas M., and Cabruja E. Microelectron. J. 37 (2006) 308
7. P. Kuhlkamp, Lead (Pb)-Free Plating for Electronics and Avoidance of Whisker Formation (http://www.atotech.com/start.php3?cl_my_id=892439&cl_new_lang=uk).
8. Suganuma K. Curr. Opin. Solid. St. M. 5 (2001) 55
9. Fukuda M., Imayoshi K., and Matsumoto Y. J. Electrochem. Soc. 149 (2002) C244
10. Fukuda M., Imayoshi K., and Matsumoto Y. Surf. Coat. Technol. 169-170 (2003) 128
11. Hu C.C., Wang C.K., and Lee G.L. Electrochim. Acta 51 (2006) 3692
12. Kikuchi S., Nishimura M., Suetsugu K., Ikari T., and Matsushige K. Mater. Sci. Eng. A319 (2001) 475
13. Prasad L.C., and Mikula A. J. Alloy. Compd. 282 (1999) 279
14. Gong J., and Zangari G. Mater. Sci. Eng. A 344 (2003) 268
15. Hu C.C., and Li J.L. J. Chin. Inst. Chem. Eng. 37 (2006) 589
16. Bockris J.OM., and Khan S.U.M. Surface Electrochemistry: A Molecular Level Approach (1993), Plenum Press, New York p. 361
17. Pletcher D., and Walsh F.C. Industrial Electrochemistry. second ed. (1993), Blackie Academic & Professional, London
18. Hu C.C., and Chang C.Y. Mater. Chem. Phys. 86 (2004) 195
19. M. Fleischmann, S. Pons, D.R. Rolision, P.P. Schmidt, Datatech Systems, Inc. (Ed.), Scientific Publishing Division 1987.
20. Bard A.J., and Faulkner L.R. Electrochemical Methods, Fundamentals and Applications. second ed. (1980), Wiley & Sons Inc., Singapore
21. Diggle J.W., and Damjanovic A. Sov. Electrochem. 1 (1971) 1063
22. Despic A.R., and Popov K.I. Modern Aspects of Electrochemistry (1972), Plenum Press, New York p.199
23. Brenner A. Electrodeposition of Alloys, Principles and Practice (1963), Academic Press, New York
24. Limson J., and Nyokong T. Anal. Chim. Acta 344 (1997) 87
25. Mohd Y., and Pletcher D. Electrochim. Acta 52 (2006) 786
26. Sun B.K., and O'Keefe T.J. Surf. Coat. Technol. 106 (1998) 44
27. IBM Research Report: Immersion plating of bismuth on tin-based alloys to stabilize lead-free solders (http://domino.watson.ibm.com/).
28. Nagy Z., Blaudeau J.P., Hung N.C., Curtiss L.A., and Zurawski D.J. J. Electrochem. Soc. 142 (1995) L87
29. Dow W.P., and Huang H.S. J. Electrochem. Soc. 152 (2005) C67
30. Dow W.P., Huang H.S., Yen M.Y., and Huang H.C. J. Electrochem. Soc. 152 (2005) C425
31. Safonova T.Y., Khairullin D.R., Tsirlina G.A., Petrii O.A., and Vassiliev S.Y. Electrochim. Acta 50 (2005) 4752
32. Bonou L., Eyraud M., Denoyel R., and Massiani Y. Electrochim. Acta 47 (2002) 4139
33. Jiang S., Huang Y.H., Luo F., Du N., and Yan C.H. Inorg. Chem. Commun. 6 (2003) 781