Composition control of Sn-Bi deposits: Interactive effects of citric acid, ethylenediaminetetraacetic acid, and poly(ethylene glycol)

Journal of the Electrochemical Society

Volumn 156, Issue 11, 2009, Pages

  Tsai, Yi Da ^a   Hu, Chi Chang ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPLEX AGENT; COMPOSITION CONTROL; CONCENTRATION OF; ETHYLENEDIAMINETETRAACETIC ACID; INTERACTIVE EFFECT; LINEAR SWEEP VOLTAMMETRY; NEGATIVE VALUES; ONSET POTENTIAL; PLATING BATH; PLATING SOLUTIONS; SCANNING ELECTRON MICROSCOPIC; SN-BI ALLOY;

ACIDS; BISMUTH; BISMUTH COMPOUNDS; CITRIC ACID; DEPOSITS; ELECTROPLATING; ETHYLENE; ETHYLENE GLYCOL; POLYETHYLENE GLYCOLS; POLYETHYLENE OXIDES; SPECTROSCOPIC ANALYSIS; TIN DEPOSITS;

TIN;

EID: 70349750305     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3224861     Document Type: Article

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