Composition control of tin-zinc deposits using experimental strategies

Electrochimica Acta

Volumn 51, Issue 18, 2006, Pages 3692-3698

  Hu, Chi Chang ^a   Wang, Chun Kou ^a   Lee, Gen Lan ^a  

^a NATIONAL CHUNG CHENG UNIVERSITY   (Taiwan)

Author keywords

Central composite design; Electroplating; Eutectic point; Fractional factorial design; Sn Zn deposit

Indexed keywords

ELECTROPLATING; PH EFFECTS; REGRESSION ANALYSIS; THERMAL EFFECTS; ZINC ALLOYS;

CENTRAL COMPOSITE DESIGN; EUTECTIC POINT; FRACTIONAL FACTORIAL DESIGN; SN-ZN DEPOSIT;

TIN DEPOSITS;

EID: 33646081764     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2005.10.025     Document Type: Article

References (26)

1. Davis E.M., Harding W.E., Schwartz R.S., and Corning J.J. IBM J. Res. Dev. (1964) 102
2. Carano M. Plat. Surf. Finish. 91 (2004) 36
3. VanHorn C., Oberle R., Shawhan G., and Packaging. Production Conference-Proceedings of the Technical Program (West and East), vol. 1 (1997) 336
4. Bratin P., Shalyt E., Pavlov M., and Berkmans J. Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium (2003) 395
5. Carano M. Plat. Surf. Finish. 90 (2003) 44
6. Kohl P.A. J. Electrochem. Soc. 129 (1982) 1196
7. Arai S., Akatsuka H., and Kaneko N. J. Electrochem. Soc. 150 (2003) C730
8. Joseph S., Phatak G.J., Seth T., Gurunathan K., Amalnerkar D.P., and Kutty T.R.N. IEEE Region 10 Annual International Conference Proceedings/TENCON, vol. 4 (2003) 1367
9. Khaselev O., Zavarine I.S., Vysotskaya, Fan C., Zhang Y., and Abys J. Trans. Inst. Met. Finish. 80 (2002) 200
10. Yanada I., and Gudeczauskas D. Proceedings of the AESF Annual Technical Conference (1999) 457
11. Jung E., Aschenbrenner R., Kallmayer Ch., Coskina P., and Reichl H. Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes Properties and Interfaces (2001) 119
12. Kiumi R., Yoshioka J., Kuriyama F., Saito N., and Shimoyama M. Proceedings-Electronic Components and Technology Conference (2002) 711
13. Horkans J. J. Electrochem. Soc. 128 (1981) 45
14. Brenner A. Electrodeposition of Alloys, vols. 1 and 2 (1963), Academic Press, New York/London
15. Cornall J.A. How to Apply Response Surface Methodology, vol. 8 (1990), ASQC, Wisconsin
16. Montgomery D.C. Design and Analysis of Experiments. fifth ed. (1997), J. Wiley & Sons, Singapore
17. Box G.E.P., Hunter W.G., and Hunter J.S. Statistics for Experiments (1978), J. Wiley & Sons, New York p. 374
18. Hu C.-C., and Bai A. Surf. Coat. Technol. 137 (2001) 181
19. Tsay P., and Hu C.-C. J. Electrochem. Soc. 149 (2002) C492
20. Hu C.-C., and Tsou T.-W. J. Power Sources 115 (2003) 179
21. Cuthbertson J.W., and Angles R.M. J. Electrochem. Soc. 94 (1948) 73
22. Davies A.E., and Angles R.M. Trans. Inst. Met. Finish. 33 (1956) 277
23. Aotani K. J. Electrochem. Soc. Jpn. 21 (1953) 21
24. Wang K., Pickering H.W., and Weil K.G. Electrochim. Acta 46 (2001) 3835
25. Guaus E., and Torrent-Burgues J. J. Electroanal. Chem. 549 (2003) 25
26. Kim K.-Y., and Yang Y. Surf. Coat. Technol. 64 (1994) 99