A novel bumping process for fine pitch Sn-Cu lead-free plating-based flip chip solder bumps

Materials Science in Semiconductor Processing

Volumn 10, Issue 4-5, 2007, Pages 133-142

  Huang, Jung Tang ^a   Chao, Pen Shan ^a   Hsu, Hou Jun ^a   Shih, Sheng Hsiung ^a  

^a NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY   (Taiwan)

Author keywords

Electroplating; Fine pitch; Flip chip; Polishing; Solder bump

Indexed keywords

COPPER; ELECTRONICS PACKAGING; ELECTROPLATING; OPTIMIZATION; PARAMETER ESTIMATION; TIN;

FINE PITCH; MATERIAL REMOVAL RATE (MRR); SOLDER BUMPS;

FLIP CHIP DEVICES;

EID: 40849089206     PISSN: 13698001     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mssp.2007.07.001     Document Type: Article

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