Effects of thiourea and polyoxyethylene lauryl ether on electrodeposition of Sn-Ag-Cu alloy as a Pb-free solder

Journal of the Electrochemical Society

Volumn 149, Issue 5, 2002, Pages

  Fukuda, Mitsunobu ^a   Imayoshi, Kohei ^b   Matsumoto, Yasumichi ^b  

^a Kumamoto Bosei Kogyo   (Japan)

^b KUMAMOTO UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVES; ELECTRODEPOSITION; ETHERS; EUTECTICS; LEAD; MELTING; PHASE DIAGRAMS; POSITIVE IONS; SOLDERING ALLOYS;

LEAD-FREE SOLDERS;

TIN ALLOYS;

EID: 0036572004     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1463404     Document Type: Article

References (15)