Effect of additives on the co-electrodeposition of Sn-Ag-Cu lead-free solder composition

Materials Science and Engineering: B

Volumn 168, Issue 1, 2010, Pages 219-223

  Joseph, Shany ^a   Phatak, Girish J ^a  

^a CENTRE FOR MATERIALS FOR ELECTRONICS TECHNOLOGY C MET   (India)

Author keywords

Additives; Lead free solders; Sn Ag Cu; Solder bumping; Ternary bath

Indexed keywords

CHELATION; COPPER ALLOYS; ELECTRODEPOSITION; ELECTRODES; FLIP CHIP DEVICES; METALS; MICROSTRUCTURE; PASSIVATION; SILVER ALLOYS; SOLDERING; TERNARY ALLOYS; TIN ALLOYS;

CHELATING AGENT; CO-ELECTRODEPOSITION; CU FILMS; LEAD-FREE SOLDER COMPOSITION; METHANESULPHONIC ACID; PASSIVATING FILMS; SN-AG-CU; SN-AG-CU LEAD-FREE SOLDERS; SOLDER BUMPING; TERNARY BATH;

LEAD-FREE SOLDERS;

EID: 77951620592     PISSN: 09215107     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mseb.2010.01.017     Document Type: Article

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