Effect of adsorption of polyoxyethylene laurylether on electrodeposition of Pb-free Sn alloys

Surface and Coatings Technology

Volumn 169-170, Issue , 2003, Pages 128-131

  Fukuda, Mitsunobu ^a   Imayoshi, Kohei ^b   Matsumoto, Yasumichi ^b  

^a Kumamoto Bosei Kogyo   (Japan)

^b KUMAMOTO UNIVERSITY   (Japan)

Author keywords

Bismuth; Copper; Electroplating; Pb free; Silver; Tin

Indexed keywords

ADSORPTION; ELECTROLYSIS; SOLDERING ALLOYS; TIN ALLOYS;

LEAD FREE SOLDERS;

ELECTRODEPOSITION;

COATING; COPPER; ELECTROPLATING; SILVER; SURFACE TREATMENT; TIN;

EID: 0037793200     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0257-8972(03)00191-9     Document Type: Article

References (8)

1. Nawafune H. Shiba K. Mizumoto S. Takeuchi T. Aoki K. J. Surface Finishing Soc. Jpn. 51 2000 1234
2. Arai S. Kaneko N. Shinohara N. Electrochemistry 69 2001 254
3. Jordan M. Trans. IMF 75 1997 149
4. Tanaka H. Tanimoto M. Matsuda A. Uno T. Kurihara M. Shiga S. J. Electron. Mater. 28 1999 1216
5. Nawafune H. Ikeda K. Mizumoto S. Takeuchi T. Aoki K. J. Surface Finishing Soc. Jpn. 48 1997 1007
6. Arai S. Funaoka Y. Kaneko N. Shinohara N. Electrochemistry 69 2001 319
7. Fukuda M. Hirakawa K. Matsumoto Y. J. Surface Finishing Soc. Jpn. 50 1999 1125
8. Fukuda M. Imayoshi K. Matsumoto Y. Electrochim. Acta 47 2001 459