Electrochemically deposited tin-silver-copper ternary solder alloys

Journal of the Electrochemical Society

Volumn 150, Issue 2, 2003, Pages

  Kim, Bioh ^a   Ritzdorf, Tom ^a  

^a Semitool Incorporated   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURRENT DENSITY; ELECTRODEPOSITION; FILM PREPARATION; SCANNING ELECTRON MICROSCOPY; TERNARY SYSTEMS; TIN ALLOYS;

CATHODIC POLARIZATION;

SOLDERING ALLOYS;

EID: 0037329009     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1530153     Document Type: Article

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