Effects of plating conditions on the microstructure of 80Sn - 20Pb electrodeposits from an organic sulphonate bath

Surface and Coatings Technology

Volumn 78, Issue 1-3, 1996, Pages 56-63

  Kim, Jeong Han ^a   Suh, Min Suk ^a   Kwon, Hyuk Sang ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

80Sn 20Pb; Electrodeposit; Organic sulphonate bath; Soldering; Texture

Indexed keywords

COPPER ALLOYS; CRYSTALS; CURRENT DENSITY; EFFECTS; ELECTRODEPOSITION; LEAD ALLOYS; MICROSTRUCTURE; MORPHOLOGY; SOLDERING ALLOYS; TEXTURES; TIN ALLOYS;

ALLOY DEPOSITS; GRAIN MORPHOLOGY; ORGANIC SULPHONATE BATH; PULSED CURRENTS;

ELECTROPLATING;

EID: 0029779040     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/0257-8972(94)02392-1     Document Type: Article

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