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Volumn 52, Issue 1, 2012, Pages 180-189

Influence of trace alloying elements on the ball impact test reliability of SnAgCu solder joints

Author keywords

[No Author keywords available]

Indexed keywords

BALL IMPACT TEST; CU SUBSTRATE; ELECTROPLATED NI; FRACTURE MODE; HIGH STRAIN RATE DEFORMATION; IMPACT FORCE; IMPACT FRACTURE; IMPACT VELOCITIES; KIRKENDALL VOID; MATRIX; MN-DOPED; MULTI-LAYERED; RE-DOPING; SN-AG-CU; SNAGCU SOLDER; SOLDER JOINTS; SURFACE FINISHES; THICKNESS RATIO; TRACE AMOUNTS;

EID: 84155171125     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2011.09.003     Document Type: Conference Paper
Times cited : (21)

References (37)
  • 33
    • 84155171475 scopus 로고
    • Doctoral Dissertation, Lehigh University
    • Oh M. Doctoral Dissertation, Lehigh University; 1994.
    • (1994)
    • Oh, M.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.