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Volumn 52, Issue 1, 2012, Pages 180-189
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Influence of trace alloying elements on the ball impact test reliability of SnAgCu solder joints
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Author keywords
[No Author keywords available]
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Indexed keywords
BALL IMPACT TEST;
CU SUBSTRATE;
ELECTROPLATED NI;
FRACTURE MODE;
HIGH STRAIN RATE DEFORMATION;
IMPACT FORCE;
IMPACT FRACTURE;
IMPACT VELOCITIES;
KIRKENDALL VOID;
MATRIX;
MN-DOPED;
MULTI-LAYERED;
RE-DOPING;
SN-AG-CU;
SNAGCU SOLDER;
SOLDER JOINTS;
SURFACE FINISHES;
THICKNESS RATIO;
TRACE AMOUNTS;
ALLOYING ELEMENTS;
FRACTURE;
IMPACT RESISTANCE;
INTERMETALLICS;
MANGANESE;
RARE EARTH ADDITIONS;
SOLDERED JOINTS;
SOLDERING ALLOYS;
STRAIN RATE;
SUBSTRATES;
TRACE ELEMENTS;
TIN;
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EID: 84155171125
PISSN: 00262714
EISSN: None
Source Type: Journal
DOI: 10.1016/j.microrel.2011.09.003 Document Type: Conference Paper |
Times cited : (21)
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References (37)
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