메뉴 건너뛰기




Volumn 25, Issue 7, 2010, Pages 1312-1320

Microstructure evolution and microimpact performance of Sn-Ag-Cu solder joints under thermal cycle test

Author keywords

[No Author keywords available]

Indexed keywords

A-THERMAL; BEFORE AND AFTER; FRACTURE BEHAVIOR; IMC LAYER; INTERFACIAL FRACTURE; INTERMETALLIC COMPOUNDS; MICROSTRUCTURE EVOLUTIONS; SNAGCU SOLDER; SOLDER BALLS; SOLDER JOINTS; STRUCTURAL VARIATIONS; THERMAL CYCLE TESTS; WHISKER FORMATION;

EID: 77957941138     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2010.0162     Document Type: Article
Times cited : (5)

References (22)
  • 1
    • 71049120499 scopus 로고    scopus 로고
    • Thermomechanical behaviour of environmentally-benign Pb-free solders
    • N. Chawla: Thermomechanical behaviour of environmentally-benign Pb-free solders. Int. Mater. Rev. 54, 368 (2009).
    • (2009) Int. Mater. Rev. , vol.54 , pp. 368
    • Chawla, N.1
  • 2
    • 0041384484 scopus 로고    scopus 로고
    • Effect of solder joint shape and height on thermal fatigue lifetime
    • X. Liu and G.Q. Lu: Effect of solder joint shape and height on thermal fatigue lifetime. IEEE Trans. Compon. Packag. Technol. 26, 455 (2003).
    • (2003) IEEE Trans. Compon. Packag. Technol. , vol.26 , pp. 455
    • Liu, X.1    Lu, G.Q.2
  • 3
    • 33645453111 scopus 로고    scopus 로고
    • Effect of sample size on the solidification temperature and microstructure of SnAgCu near eutectic alloys
    • R. Kinyanjui, L.P. Lehman, L. Zavalij, and E. Cotts: Effect of sample size on the solidification temperature and microstructure of SnAgCu near eutectic alloys. J. Mater. Res. 20, 2914 (2005).
    • (2005) J. Mater. Res. , vol.20 , pp. 2914
    • Kinyanjui, R.1    Lehman, L.P.2    Zavalij, L.3    Cotts, E.4
  • 5
    • 0036710411 scopus 로고    scopus 로고
    • Orien-tation imaging studies of Sn-based electronic solder joints
    • A.U. Telang, T.R. Bieler, S. Choi, and K.N. Subramanian: Orien-tation imaging studies of Sn-based electronic solder joints. ,J. Mater. Res. 17, 2294 (2002).
    • (2002) J. Mater. Res. , vol.17 , pp. 2294
    • Telang, A.U.1    Bieler, T.R.2    Choi, S.3    Subramanian, K.N.4
  • 6
    • 38649088577 scopus 로고    scopus 로고
    • Microstructure characterization and creep behavior of Sn-rich solder alloys, Part I: Microstructure characterization
    • R.S. Sidhu and N. Chawla: Microstructure characterization and creep behavior of Sn-rich solder alloys, Part I: Microstructure characterization. Metall. Mater. Trans. A 39, 340 (2008).
    • (2008) Metall. Mater. Trans. A , vol.39 , pp. 340
    • Sidhu, R.S.1    Chawla, N.2
  • 7
    • 38649117869 scopus 로고    scopus 로고
    • Microstructure characteri-zation and creep behavior of Sn-rich solder alloys. Part II: Creep behavior
    • R.S. Sidhu, X. Deng, and N. Chawla: Microstructure characteri-zation and creep behavior of Sn-rich solder alloys. Part II: Creep behavior. Metall. Mater. Trans. A 39, 349 (2008).
    • (2008) Metall. Mater. Trans. A , vol.39 , pp. 349
    • Sidhu, R.S.1    Deng, X.2    Chawla, N.3
  • 8
    • 43249090649 scopus 로고    scopus 로고
    • Thermal fatigue prop-erties and grain boundary character distribution in Sn-xAg-0.5Cu (x = 1, 1.2, and 3) lead free solder interconnects
    • S. Terashima, M. Tanaka, and K. Tasumi: Thermal fatigue prop-erties and grain boundary character distribution in Sn-xAg-0.5Cu (x = 1, 1.2, and 3) lead free solder interconnects. Sci. Technol. Weld. Joining 13, 60 (2008).
    • (2008) Sci. Technol. Weld. Joining , vol.13 , pp. 60
    • Terashima, S.1    Tanaka, M.2    Tasumi, K.3
  • 9
    • 35348818002 scopus 로고    scopus 로고
    • Thermal cycling aging effect on the reliability and morphological evolution of SnAgCu solder joints
    • J.W.R. Teo: Thermal cycling aging effect on the reliability and morphological evolution of SnAgCu solder joints. IEEE Trans. Compon. Packag. Technol. 30, 279 (2007).
    • (2007) IEEE Trans. Compon. Packag. Technol. , vol.30 , pp. 279
    • Teo, J.W.R.1
  • 10
    • 35648968080 scopus 로고    scopus 로고
    • Evaluation of solder joint strengths under ball impact test
    • Y.S. Lai, H.C. Chang, and C.L. Yeh: Evaluation of solder joint strengths under ball impact test. Microeleetron. Reliab. 47, 2179 (2007).
    • (2007) Microeleetron. Reliab. , vol.47 , pp. 2179
    • Lai, Y.S.1    Chang, H.C.2    Yeh, C.L.3
  • 13
    • 24644455360 scopus 로고    scopus 로고
    • Micro-impact test on lead-free BGA balls on Au/electrolytic Ni/Cu bond pad
    • Reno, NV
    • S.Q. Ou, Y.H. Xu, and K.N. Tu: Micro-impact test on lead-free BGA balls on Au/electrolytic Ni/Cu bond pad, in Proceedings of the 55th Electron. Comp. Tech. Conf. (Reno, NV, 2005), p. 467.
    • (2005) Proceedings of the 55th Electron. Comp. Tech. Conf. , pp. 467
    • Ou, S.Q.1    Xu, Y.H.2    Tu, K.N.3
  • 14
    • 0742287928 scopus 로고    scopus 로고
    • Young's modulus of (Cu,Ag)-Sn intermetallics measured by nanoinden-tation
    • X. Deng, M. Koopman, N. Chawla, and K.K. Chawla: Young's modulus of (Cu,Ag)-Sn intermetallics measured by nanoinden-tation. Mater. Sci. Eng., A 364, 240 (2004).
    • (2004) Mater. Sci. Eng., A , vol.364 , pp. 240
    • Deng, X.1    Koopman, M.2    Chawla, N.3    Chawla, K.K.4
  • 15
    • 42949110612 scopus 로고    scopus 로고
    • The micro-impact fracture behavior of lead-free solder ball joints
    • Y.L. Huang, K.L. Lin, and D.S. Liu: The micro-impact fracture behavior of lead-free solder ball joints. J. Mater. Res. 23, 1057 (2008).
    • (2008) J. Mater. Res. , vol.23 , pp. 1057
    • Huang, Y.L.1    Lin, K.L.2    Liu, D.S.3
  • 17
    • 0032083872 scopus 로고    scopus 로고
    • Spontaneous growth mechanism of tin whiskers
    • B.Z. Lee and D.N. Lee: Spontaneous growth mechanism of tin whiskers. Acta. Mater. 46, 3701 (1998).
    • (1998) Acta. Mater. , vol.46 , pp. 3701
    • Lee, B.Z.1    Lee, D.N.2
  • 18
    • 40549124356 scopus 로고    scopus 로고
    • Thermal fatigue behavior of Sn-rich (Pb-Free) solders
    • R.S. Sidhu and N. Chawla: Thermal fatigue behavior of Sn-rich (Pb-Free) solders. Metall. Mater. Trans. A 39, 799 (2008).
    • (2008) Metall. Mater. Trans. A , vol.39 , pp. 799
    • Sidhu, R.S.1    Chawla, N.2
  • 21
    • 70249151489 scopus 로고    scopus 로고
    • Warpage analysis of flip-chip PBGA packages subject to thermal loading
    • M.Y. Tsai, H.Y. Chang, and M. Pecht: Warpage analysis of flip-chip PBGA packages subject to thermal loading. IEEE Trans. Device Mater. Reliab. 9, 419 (2009).
    • (2009) IEEE Trans. Device Mater. Reliab. , vol.9 , pp. 419
    • Tsai, M.Y.1    Chang, H.Y.2    Pecht, M.3
  • 22
    • 4444283043 scopus 로고    scopus 로고
    • Investigation of thermome-chanical behaviors of nip chip BGA packages during manufactur-ing process and thermal cycling
    • M. Y. Tsai, C.H. Hsu, and C.T. Wang: Investigation of thermome-chanical behaviors of nip chip BGA packages during manufactur-ing process and thermal cycling. IEEE Trans. Compon. Packag. Technol. 27, 568 (2004).
    • (2004) IEEE Trans. Compon. Packag. Technol. , vol.27 , pp. 568
    • Tsai, M.Y.1    Hsu, C.H.2    Wang, C.T.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.