SCOPUS 정보 검색 플랫폼

Volumn 50, Issue 5, 2009, Pages 1231-1234

Strain rate dependence on nanoindentation responses of interfacial intermetallic compounds in electronic solder joints with Cu and Ag substrates

(5) Song, Jenn Ming a Shen, Yu Lin a Su, Chien Wei a Lai, Yi Shao b Chiu, Ying Ta b

a NATIONAL DONG HWA UNIVERSITY (Taiwan)

b ADVANCED SEMICONDUCTOR ENGINEERING INC (Taiwan)

Author keywords

Intermetallic compounds; Nanoindentation; Soldering; Strain rate sensitivity exponent (M)

Indexed keywords

AG SUBSTRATE; CU-BASED; ELECTRONIC SOLDERS; INTERFACIAL INTERMETALLICS; INTERMETALLIC COMPOUNDS; LOADING RATE; MECHANICAL BEHAVIOR; PB FREE SOLDERS; RATE SENSITIVE; SN-AG-CU; STRAIN RATE DEPENDENCE; STRAIN RATE SENSITIVITY EXPONENT (M);

BRAZING; CRYSTAL STRUCTURE; LEAD; LEAD COMPOUNDS; NANOINDENTATION; SEMICONDUCTING INTERMETALLICS; SILVER; SOLDERING ALLOYS; TIN; WELDING; ZINC;

STRAIN RATE;

EID: 67650478309 PISSN: 13459678 EISSN: None Source Type: Journal
DOI: 10.2320/matertrans.M2009016 Document Type: Conference Paper

Times cited : (37)

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