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Volumn 37, Issue 6, 2008, Pages 887-893
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Electromigration of Sn-9wt.%Zn solder
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Author keywords
Electromigration; Microstructure; Sn 9wt. Zn; Zn precipitates
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Indexed keywords
BLOCKING EFFECTS;
EXTRUSION SITES;
IMMOBILE;
ANODES;
ELECTROMIGRATION;
EXTRUSION;
MICROSTRUCTURE;
MORPHOLOGY;
PRECIPITATES;
SURFACE MORPHOLOGY;
TIN;
SOLDERED JOINTS;
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EID: 42449097152
PISSN: 03615235
EISSN: None
Source Type: Journal
DOI: 10.1007/s11664-008-0402-y Document Type: Article |
Times cited : (26)
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References (18)
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