Electromigration effects on intermetallic growth at wire-bond interfaces

Journal of Electronic Materials

Volumn 35, Issue 11, 2006, Pages 1961-1968

  Orchard, H T ^a   Greer, A L ^a  

^a UNIVERSITY OF CAMBRIDGE   (United Kingdom)

Author keywords

Au Al; Electromigration; Intermetallic; Wire bond

Indexed keywords

BIMETALLIC INTERFACE; INTERMETALLIC GROWTH; POLARITY; WIRE BOND;

ELECTRIC RESISTANCE; ELECTROMIGRATION; FAILURE (MECHANICAL); INTERFACES (COMPUTER); INTERMETALLICS; MICROSTRUCTURE;

SEMICONDUCTOR GROWTH;

EID: 33845725618     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-006-0300-0     Document Type: Conference Paper

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