Role of bonding time and temperature on the physical properties of coupled anisotropic conductive-nonconductive adhesive film for flip chip on glass technology

Microelectronic Engineering

Volumn 85, Issue 1, 2008, Pages 238-244

  Rizvi, M J ^a   Lu, H ^a   Bailey, C ^a   Chan, Y C ^b   Lee, M Y ^c   Pang, C H ^c  

^a UNIVERSITY OF GREENWICH   (United Kingdom)

^b CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^c ASM Assembly Automation Ltd   (Hong Kong)

Author keywords

Adhesive; Curing; Glass transition temperature; Loss modulus; Storage modulus

Indexed keywords

ADHESIVES; CURING; DYNAMIC MECHANICAL ANALYSIS; ELASTIC MODULI; GLASS TRANSITION; SUPERCONDUCTING TRANSITION TEMPERATURE;

CONDUCTIVE-NONCONDUCTIVE ADHESIVE FILMS; LOSS MODULUS;

CONDUCTIVE FILMS;

EID: 36248960060     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2007.05.045     Document Type: Article

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