Effect of underfill entrapment on the reliability of flip-chip solder joint

Journal of Electronic Packaging

Volumn 126, Issue 4, 2004, Pages 541-545

  Chan, Y C ^a   Alam, M O ^a   Hung, K C ^a   Lu, H ^a   Bailey, C ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FLIP CHIP DEVICES; INTEGRATED CIRCUITS; INTERCONNECTION NETWORKS; SOLDERED JOINTS; THERMAL CYCLING; THERMAL EXPANSION;

FLIP CHIP BONDING; REOXIDATION; SURFACE MOUNTING TECHNOLOGY (SMT); THERMAL SHOCKS;

ELECTRONICS PACKAGING;

EID: 13944280751     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1756590     Document Type: Article

References (14)

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