Effect of filler content on the dielectric properties of anisotropic conductive adhesives materials for high-frequency flip-chip interconnection

Materials Science and Engineering: B

Volumn 126, Issue 1, 2006, Pages 59-65

  Yim, Myung Jin ^a   Kwon, Woonseong ^a   Paik, Kyung Wook ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Anisotropic conductive film; Dielectric permittivity; Electrical measurement; Flip chip technology; High frequency

Indexed keywords

ADHESIVES; DIELECTRIC MATERIALS; ELECTRIC VARIABLES MEASUREMENT; NATURAL FREQUENCIES; PERMITTIVITY;

ANISOTROPIC CONDUCTIVE FILMS (ACF); ELECTRICAL MEASUREMENT; FLIP-CHIP JOINTS; FLIP-CHIP TECHNOLOGY; HIGH-FREQUENCY;

CONDUCTIVE FILMS;

EID: 27944446558     PISSN: 09215107     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mseb.2005.08.114     Document Type: Article

References (12)

1. L.S. Goldmann, and P.A. Totta Solid State Technol. 1983 91 97
2. J.H. Lau, and S. Erasmus Electron. Packag. Prod. 1993 51 56
3. L.F. Miller IBM J. Res. Dev. 1969 239 250
4. L.S. Goldmann, and P.A. Totta Chip on Board Technologies for Multichip Modules 1994 Van Nostrand Reinhold NY pp. 228-250
5. T. Kamei, and M. Nakamura Proceedings of the IEEE Electronic Components Conference 1978 172 182
6. A. Torri, M. Takizawa, and K. Sasahara Proceedings of the Ninth International Microelectronics Conference 1996 324 327
7. D.J. Williams Solder. Surf. Mount. Technol. 1993 4 8
8. J. Liu, A. Tolvgard, J. Malmodin, and Z. Lai IEEE Trans. Comp. Packag. Manuf. Technol. 22 2 1999 186 190
9. M.J. Yim IEEE Trans. Comp. Packag. Technol. 22 4 1999 575 581
10. W.H. Ryu IEEE Trans. Electr. Packag. Technol. 23 3 2000 542 545
11. R. Sihlbom IEEE Trans. Comp. Packag. Manuf. Technol. A 21 1998 469 477
12. I.A. Tchmutin J. Polym. Sci. B Polym. Phys. 36 1998 1847 1856