Reliability and failure mode of chip-on-film with non-conductive adhesive

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002

Volumn , Issue , 2002, Pages 157-160

  Hsieh, Yu Te ^a  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; CONDUCTIVE FILMS; ELASTIC MODULI; FAILURE ANALYSIS; FAILURE MODES; GLASS BONDING; INTEGRATED CIRCUIT INTERCONNECTS; JOINING; MODIFIED ATMOSPHERE PACKAGING; RELIABILITY; RELIABILITY ANALYSIS;

ANISOTROPIC CONDUCTIVE FILMS; BASIC CHARACTERISTICS; FAILURE MODE ANALYSIS; INTERCONNECTION TECHNOLOGY; NON-CONDUCTIVE ADHESIVES; PARAMETER OPTIMIZATION; TAPE-AUTOMATED BONDINGS; THICKNESS OF THE FILM;

QUALITY CONTROL;

EID: 84966589373     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2002.1188830     Document Type: Conference Paper

References (2)

1. Shyh-Ming Chang, Jwo-Huei Jou, Adam Hsieh, Tai-Hong Chen, Jui-Nin Jao, and Hua-Shu Wu, "Internal Stress and Connection Resistance Correlation Study of Micro-Bump Bonding", IEEE Transactions on Component & Packaging Technology, accepted.
2. Shyh-Ming Chang, Jwo-Huei Jou, Adam Hsieh, Tai-Hong Chen, Ching-Yun Chang, Yung-Hao Wang, and Chun-Ming Huang, "Characteristic Study of Anisotropic-Conductive-Film for Chip-on-Film Packaging", Microelectronics Reliability, accepted.