Nonlinear sequential bayesian analysis-based decision making for end-point detection of chemical mechanical planarization (CMP) processes

IEEE Transactions on Semiconductor Manufacturing

Volumn 24, Issue 4, 2011, Pages 523-532

  Kong, Zhenyu ^a   Beyca, Omer ^a   Bukkapatnam, Satish T ^a   Komanduri, Ranga ^b  

^a Oklahoma State University   (United States)

^b NONE

Author keywords

Integrated circuit manufacture; intelligent sensors; manufacturing automation; sequential decision procedures

Indexed keywords

BAYESIAN ANALYSIS; CHEMICAL-MECHANICAL PLANARIZATION PROCESS; CMP PROCESS; COPPER CMP; COST-EFFECTIVE SENSORS; DECISION PROCEDURE; DEMAND VARIATIONS; END POINT DETECTION; END POINTS; EXPERIMENTAL INVESTIGATIONS; GROWING DEMAND; IN-PROCESS; IN-PROCESS SENSORS; INTELLIGENT SENSORS; INTERLEVEL DIELECTRIC; MANUFACTURING AUTOMATION; MATERIAL REMOVAL; METALLIC INTERCONNECTS; ON-WAFER; OPTIMAL PERFORMANCE; PLANAR SURFACE; POLISHING PROCESSS; PROCESS PERFORMANCE; PROCESS SETTINGS; SEMICONDUCTOR INDUSTRY; SEMICONDUCTOR MANUFACTURING INDUSTRY; SENSOR INFORMATIONS; STANDARD DEVIATION; SYSTEM USE; SYSTEM-BASED; THICKNESS VARIATION; TIME STEP; UNCERTAIN INFORMATIONS; VIBRATION SENSORS; WAFER SURFACE; WAFER YIELDS; WIRELESS MEMS; WIRELESS VIBRATION SENSORS;

COST FUNCTIONS; COSTS; DECISION MAKING; DECISION THEORY; INTEGRATED CIRCUITS; MANUFACTURE; OPTIMIZATION; POINT CONTACTS; POLISHING; SEMICONDUCTOR DEVICE MANUFACTURE; SENSORS; SILICON WAFERS; SURFACE ROUGHNESS; SURFACES; VENTILATION EXHAUSTS; VIBRATION ANALYSIS;

CHEMICAL DETECTION;

EID: 80455156060     PISSN: 08946507     EISSN: None     Source Type: Journal    
DOI: 10.1109/TSM.2011.2164100     Document Type: Article

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