Developing effective inspection systems and strategies for monitoring CMP processes

MICRO

Volumn 16, Issue 2, 1998, Pages 31-41

  Dennison, Cheri ^a,b,c,d  

^a KLA TENCOR CORPORATION   (United States)

^b Motorolas's Phoenix Facility   (United States)

^c Stanford University   (United States)

^d Wafer Inspection Applic Org

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL POLISHING; DEFECTS; IMAGE PROCESSING; INTEGRATED CIRCUIT MANUFACTURE; LASER BEAMS; LIGHT SCATTERING; OXIDES; POLYSTYRENES;

BRIGHT FIELD IMAGE PROCESSING SYSTEMS; INTERMETAL DIELECTRIC LAYERS; LASER LIGHT SCATTERING SYSTEM; OPTICAL IN LINE WAFER INSPECTION SYSTEM;

INSPECTION EQUIPMENT;

EID: 11544373741     PISSN: 10810595     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (3)

1. Elson JM, Rahn JP, and Bennett JM, "Relationship of the Total Integrated Scattering from Multilayer Coated Optics to Angle of Incidence, Polarization, Correlation Length and Roughness Cross-Correlation Properties," Applied Optics, 22(20):3207-3219, 1983.
2. Zika S, and Bains G, "Microscratch Detection Strategies for After Oxide CMP at Shallow Trench Isolation," presented at KLA Yield Management Seminar, Geneva, Switzerland, April 1997.
3. Shih YC, and Wang JF, "Polishing Pads and Process Effects on Tungsten CMP," in Proceedings of ISMIC 1997, pp 237-240, 1997.