In-process detection of microscratching during CMP using acoustic emission sensing technology

Journal of Electronic Materials

Volumn 27, Issue 10, 1998, Pages 1099-1103

  Tang, Jianshe ^a   Dornfeld, David ^a   Pangrle, Suzette Keefe ^b   Dangca, Alvin ^b  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b ADVANCED MICRO DEVICES   (United States)

Author keywords

Acoustic; Chemical mechanical planarization (CMP); Emission; Microscratch; Sensor

Indexed keywords

ACOUSTIC EMISSIONS; MONITORING; SENSITIVITY ANALYSIS; SENSORS; TECHNOLOGY;

ACOUSTIC EMISSION SENSING TECHNOLOGY; CHEMICAL MECHANICAL PLANARIZATION; MICROSCRATCHING;

CHEMICAL POLISHING;

EID: 0032182798     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-998-0144-x     Document Type: Article

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