Endpoint detection for CMP

Journal of Electronic Materials

Volumn 27, Issue 10, 1998, Pages 1073-1081

  Bibby, Thomas ^a   Holland, Karey ^a  

^a IPEC Planar   (United States)

Author keywords

Chemical mechanical polishing; CMP; Endpoint detection; Planarization

Indexed keywords

MONITORING; OXIDES; PERFORMANCE; SILICON WAFERS; SURFACE TREATMENT;

CHEMICAL MECHANICAL POLISHING; DIELECTRIC REMOVAL RATE; ENDPOINT DETECTION; INTERLEVEL DIELECTRIC PLANARIZATION; MOTOR CURRENT MONITORING;

CHEMICAL POLISHING;

EID: 0032184282     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-998-0140-1     Document Type: Article

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