Adaptive neuro-fuzzy inference system modeling of MRR and WIWNU in CMP process with sparse experimental data

IEEE Transactions on Automation Science and Engineering

Volumn 5, Issue 1, 2008, Pages 71-82

  Lih, Wen Chen ^a,b   Bukkapatnam, Satish T S ^a   Rao, Prahalad ^a   Chandrasekharan, Naga ^c   Komanduri, Ranga ^a  

^a OKLAHOMA STATE UNIVERSITY   (United States)

^b NATIONAL DEFENSE UNIVERSITY   (Taiwan)

^c MICRON TECHNOLOGY INC   (United States)

Author keywords

Adaptive neuro fuzzy inference system (ANFIS); Chemical mechanical planarization (CMP); Neural network (NN)

Indexed keywords

ADAPTIVE SYSTEMS; FUZZY NEURAL NETWORKS; MATERIALS SCIENCE; MATHEMATICAL MODELS; PARAMETER ESTIMATION; SILICON WAFERS;

ADAPTIVE NEURO-FUZZY INFERENCE SYSTEM (ANFIS); CHEMOMECHANICAL INTERACTIONS; MATERIAL REMOVAL RATE (MRR);

CHEMICAL MECHANICAL POLISHING;

EID: 38149008325     PISSN: 15455955     EISSN: None     Source Type: Journal    
DOI: 10.1109/TASE.2007.911683     Document Type: Article

References (28)

1. SEMATECH, "Schematic of CMP process."2005 [Online]. Available: www.sematech.org
2. P. B. Zantye, A. Kumara, and A. K. Sikder, "Chemical mechanical planarization. for microelectronics applications," Materials Sci. Eng., vol. R 45, pp. 89-220, 2004.
3. R. Komanduri, D. A. Lucca, and Y. Tani, "Technological advances in fine abrasive processes," CIRP Annals, vol. 46, no. 2, pp. 545-596, 1997.
4. J. Luo and D. A. Dornfeld, "Material removal mechanism in chemical mechanical polishing: Theory and modeling," IEEE Trans. Semiconduct. Manuf., vol. 14, pp. 112-133, 2001.
5. F. W. Preston, "The theory and design of plate glass polishing machine," Int. J. Glass Sci. Technol., vol. 11, pp. 214-256, 1927.
6. S. T. S. Bukkapatnam and R. Palanna, "Experimental characterization of nonlinear dynamics underlying cylindrical grinding process," ASME Trans. Manuf Sci. Eng., vol. 126, pp. 341-344, 2004.
7. M. Hagan, H. Demuth, and M. Beale, Neural Network Design. Boston, MA: PWS, 1996.
8. G.-J Wang, J.-C Tsai, and J.-L Chen, "Method for determining efficiently parameters in chemical-mechanical polishing (CMP)," U.S. Patent 6,564, 116, May .13, 2003.
9. G.-J Wang and M.-H Chou, "A neural-taguchi based quasi time-optimal control strategy for chemical-mechanical polishing processes," in Proc. 2001 ASME Int. Mech. Eng. Congr. Expo. (IMECE2001/EPP-24716), 2001, vol. EPP-1, pp. 129-134.
10. G.-J. Wang, J.-L. Chen, and J.-Y. Hwang, "New optimization strategy for chemical mechanical polishing process," JSME Int. J., vol. 44, no. 2, pp. 534-543, 2001.
11. J. Yi, Y. Sheng, and C. S. Xu, "Neural network based uniformity profile control of linear chemical-mechanical planarization," IEEE Trans. Semiconduct. Manuf, vol. 16, pp. 609-620, 2003.
12. B. Singh, R. Subramanian, K. A. Phan, B. Rangarajan, and C. Morales, "Monitor CMP process using scatterometry," U.S. Patent 6 594 024, Jul. 15, 2003.
13. J.-S. R. Jang, "ANFIS: Adaptive-network-based fuzzy inference system," IEEE Trans. Syst., Man, Cybern., vol. 23, pp. 665-685, May 1993.
14. Z.-C. Lin and C.-Y. Liu, "Application, of an adaptive neuro-fuzzy inference system, for the optimal analysis of chemical-mechanical polishing process parameters," Int. J. Adv. Manuf. Technol., vol. 18, pp. 20-28, 2001.
15. Y. Zhao and L. Chang, "A micro-contact and wear model for chemical-mechanical polishing of silicon wafer," Wear, vol. 252, pp. 220-226, 2002.
16. J.-Y. Lai, "Mechanics, mechanisms, and modeling of chemical mechanical polishing process," Ph.D. dissertation, Dept. Mech. Eng., MIT, Cambridge, MA, U.S.A. 2001.
17. D. Wang, J. Lee, K. Holland, T. Bibby, S. Beaudoin, and T. Cale, "Von mises stress in chemical-mechanical polishing processes," J. Electrochem. Soc., vol. 144, pp. 1121-1127, 1997.
18. J. Tichy, J. A. Levert, L. Shan, and S. Danyluk, "Contact mechanics and lubrication hydrodynamics of chemical mechanical polishing," J. Electrochem. Soc., vol. 146, pp. .1523-1528, 1999.
19. J. A. Greenwood and J. B. P. Williamson, "Contact of nominally flat surface," Proc. Royal Soc. London, ser. A, vol. 295, pp. 300-319, 1996.
20. H. Hocheng, H.-Y. Tsai, and L.-J. Chen, "A kinematic analysis of CMP based on velocity model," in Proc. CMP-MIC Conf, Santa Clara, CA, Feb. 1997, pp. 277-280.
21. K. Yoshitomi, A. Une, and M. Mochida, "Ultra precision polishing with, the oscillation speed control: An analysis of the pressure distribution and the profile," Key Eng. Mater., vol. 238-239, pp. 219-222, 2003.
22. Q. Luo, S. Ramarajan, and S. V. Babu, "Modification of the Preston equation for the chemical-mechanical polishing of copper," Thin Solid Films, vol. 335, pp. 160-167, 1998.
23. M. Bilmann, U. Mahajan, and R. K. Singh, "Effect of particle size during tungsten, chemical mechanical polishing," Electrochem. Solid-State Lett., vol. 16, pp. 401-403, 1999.
24. J. Luo and D. A. Dornfeld, "Effects of abrasive size distribution in chemical-mechanical planarization for sub-micron integrated circuit fabrication: Modeling and verification," IEEE Trans. Semiconduct. Manuf, vol. 16, pp. 469-476, 2003.
25. J.-S. R. Jang, C.-T Sun, and E. Mizutani, Neuro-Fuzzy and Soft Computing. Englewood Cliffs, NJ: Prentice-Hall, 1997.
26. T. Takagi and M. Sugeno, "Derivation of fuzzy control rules from human operator's control actions," in Proc. IFAC Symp. Fuzzy Info., Knowl. Representation, Decision Anal., Jul. 1983, pp. 55-60.
27. L. Monostori, A. Márkus, H. V. Brussel, and E. Westkämper, "Machine learning approaches to manufacturing," Ann. CIRP, vol. 45, no. 2, pp. 675-712, 1996.
28. L. Monostori and Z. J. Viharos, "Hybrid, AI- and simulation-supported optimization of process chains and production plants," Ann. CIRP, vol. 50, no. 1, pp. 353-356, 2001.