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Journal of Electronic Materials

Volumn 37, Issue 10, 2008, Pages 1598-1604

Interfacial intermetallic growth and strength of composite lead-free solder alloy through isothermal aging

(5) Sivasubramaniam, V a,b Bosco, N S a Janczak Rusch, J a Cugnoni, J b Botsis, J b

a SWISS FEDERAL LABORATORIES FOR MATERIALS SCIENCE AND TECHNOLOGY (Switzerland)

b EPFL (Switzerland)

Author keywords

Aging; Intermetallic compounds; Lead free solder; Nanocomposite; Tension test

Indexed keywords

AGING; COMPOSITE SOLDERS; INTERMETALLIC COMPOUNDS; INTERMETALLIC GROWTH; INTERMETALLIC LAYERS; ISOTHERMAL AGEING; LEAD-FREE SOLDER; LEAD-FREE SOLDER ALLOYS; NANOCOMPOSITE; PARTICLE-REINFORCEMENT; TENSION TEST;

BRAZING; COPPER; COPPER ALLOYS; REINFORCEMENT; SILVER; SOLDERED JOINTS; SOLDERING ALLOYS; TIN; WELDING;

LEAD;

EID: 51849120015 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-008-0524-2 Document Type: Article

Times cited : (20)

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