Three-dimensional (3D) visualization of reflow porosity and modeling of deformation in Pb-free solder joints

Materials Characterization

Volumn 61, Issue 4, 2010, Pages 433-439

  Dudek, M A ^a   Hunter, L ^b   Kranz, S ^a   Williams, J J ^a   Lau, S H ^b   Chawla, N ^a  

^a Arizona State University   (United States)

^b XRADIA INC   (United States)

Author keywords

3D materials science; Finite element method (FEM); Porosity; X ray tomography

Indexed keywords

3D MICROSTRUCTURES; DETECTION LIMITS; EFFECT OF VOIDS; FINITE ELEMENT METHOD (FEM); FINITE ELEMENT MODELS; HIGH RESOLUTION; HIGH-RESOLUTION COMPUTED TOMOGRAPHY; LAP SHEAR; MECHANICAL PERFORMANCE; MICROSCOPIC DEFORMATIONS; PB FREE SOLDERS; SOLDER JOINTS; SOLDER/COPPER INTERFACE; STRAIN LOCALIZATIONS; TECHNIQUES USED; THREE DIMENSIONAL (3D) VISUALIZATION; THREE-DIMENSIONAL (3D); X-RAY TOMOGRAPHY;

COMPUTERIZED TOMOGRAPHY; DEFORMATION; FINITE ELEMENT METHOD; IMAGING SYSTEMS; LEAD; MICROSTRUCTURE; POROSITY; SILVER; SOLDERING ALLOYS; TIN; VISUALIZATION;

THREE DIMENSIONAL;

EID: 77949489280     PISSN: 10445803     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matchar.2010.01.011     Document Type: Article

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